Thermoconductive

Thermally conductive paste is used at the points of contact of two metals where thermal conductivity is required. It is most often some type of heatsink, either for the processor or any other type of electronic component. The base of this thermally conductive paste is silicone, and steel dust is added to it, which achieves thermal conductivity.

• Weight: 100g
• Thermal conductivity: >6W/mK

Thermal conductivity is a property often required in cases where two metals are in contact. One of them needs to be cooled, while the other is most often a refrigerator. Although thermal paste is a logical choice in this case, thermally conductive adhesive will be particularly useful in some cases, especially when the joint is under mechanical stress. This adhesive is often used in electronics to attach temperature sensors, coolers and el. components and LEDs..

• Weight: 10g
• Operating temperature: -50 – 200°C
• Thermal conductivity: 2W/mK
• Drying time: 5min do 2

4h

Instructions for use:
• The surface must be cleaned before applying the adhesive
• Apply the glue thinly, not thicker than 6mm
• Use the glue 12 months after opening

Thermally conductive paste is used at the points of contact of two metals where thermal conductivity is required. It is most often some type of heatsink, either for the processor or any other type of electronic component. The base of this thermally conductive paste is silicone, and diamond dust is added to it in a percentage of 10% to increase the thermal conductivity. Comes with a special application brush.

• Mass: 4g
• Thermal conductivityt: >4W/mK

Thermally conductive paste is used at the points of contact of two metals where thermal conductivity is required. It is most often some type of heatsink, either for the processor or any other type of electronic component. The base of this thermally conductive paste is silicone, and steel dust is added to it, which achieves thermal conductivity.

• Mass: 1g
• Thermal conductivityt: >6W/mK

Thermally conductive paste is used at the points of contact of two metals where thermal conductivity is required. It is most often some type of heatsink, either for the processor or any other type of electronic component. The base of this thermally conductive paste is silicone, and gold dust is added to it in a percentage of as much as 45%, which achieves maximum thermal conductivity – as much as 3 times higher than ordinary paste. Comes with a plastic mounting spatula.

• Mass: 1g
• Thermal conductivity: >2.8W/mK