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Solder paste is used during SMT production, i.e. when SMT components are used. The paste is placed in specific places where it’s desired to achieve a solder joint, either by hand or with a stencil. After that, the components are placed and soldered in special ovens. This paste does not require cleaning after soldering (no clean). Paste is lead-free, which means it does not contain lead.
• Composition: Sn96,5Ag3Cu0,5
• Melting point: 252°C
• Solder ball sizes: 25-45µm
• Packaging: 20g
• No clean
At e-radionica.com solder paste is stored in the refrigerator, at a temperature of 8 ° C, which is the recommended storage temperature. We recommend that you choose express delivery for orders that contain this item in order to avoid product being exposed to high temperatures.
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