Lead-free solder paste Sn96,5Ag2Cu0,5 20g

SKU: 000164
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Key features

  • Composition: Sn96,5Ag3Cu0,5
  • Melting point: 252°C
  • Solder ball sizes: 25-45µm
  • Packaging: 20g
  • Lead-free
  • No clean

Product features

Product Description

Solder paste is used during SMT production, i.e. when SMT components are used. The paste is placed in specific places where it’s desired to achieve a solder joint, either by hand or with a stencil. After that, the components are placed and soldered in special ovens. This paste does not require cleaning after soldering (no clean). Paste is lead-free, which means it does not contain lead.


• Composition: Sn96,5Ag3Cu0,5
• Melting point: 252°C
• Solder ball sizes: 25-45µm
• Packaging: 20g
• Lead-free
• No clean


At e-radionica.com solder paste is stored in the refrigerator, at a temperature of 8 ° C, which is the recommended storage temperature. We recommend that you choose express delivery for orders that contain this item in order to avoid product being exposed to high temperatures.

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