Product Description
Thermally conductive paste is used at the points of contact of two metals where thermal conductivity is required. It is most often some type of heatsink, either for the processor or any other type of electronic component. The base of this thermally conductive paste is silicone, and diamond dust is added to it in a percentage of 10% to increase the thermal conductivity. Comes with a special application brush.
• Mass: 4g
• Thermal conductivityt: >4W/mK
Product features
Complimentary technical support
In case you ever get stuck with using this product, you can count on us. We provide free, no-strings-attached technical support with this product. Just reach out to us with your questions, and we'll be there to help you. Key features
- Mass: 4g
- Thermal conductivityt: >4W/mK
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