ST67 Wireless Breakout for STM32

Wi-Fi on STM32? Now, it's possible! The ST67 Wireless Breakout gives developers instant access to the STMicroelectronics ST67W611M1, a low-power Wi-Fi 6 and Bluetooth LE 5.4 combo coprocessor native to STM32 platforms! It's placed on a convenient, breadboard-friendly breakout. The ST67W611M1 operates as a dedicated wireless coprocessor, leaving your STM32 host MCU free to run application logic. The board comes pre-flashed with the X-CUBE-ST67W61 Expansion Software Package, so you can start developing immediately out of the box.

On the Wi-Fi side, the chip supports IEEE 802.11b/g/n/ax (Wi-Fi 6) with up to 17 Mbps TCP throughput, WPA3 security, and advanced features like MU-MIMO, OFDMA, and Target Wake Time (TWT) for battery-powered applications. Bluetooth LE 5.4 runs concurrently alongside Wi-Fi, supporting speeds up to 2 Mbps across peer-to-peer, broadcast, and mesh topologies. Both radios share a built-in PCB antenna with all required RF components already on-module.

The breakout runs on a single 3.3 V supply and connects to your microcontroller via SPI (up to 40 MHz) or UART, supporting IO voltages of 1.8 V or 3.3 V for full STM32 compatibility. An onboard 32.768 kHz crystal oscillator and a bank of decoupling capacitors ensure stable, noise-free operation right out of the box. Deep sleep current is just 90 µA, making it well suited for low-power applications.

• Wireless chip: STMicroelectronics ST67W611M1A6B
• Wi-Fi standard: IEEE 802.11b/g/n/ax (Wi-Fi 6), 2.4 GHz
• Wi-Fi throughput: Up to 17 Mbps TCP
• Wi-Fi security: WPS, WEP, WPA, WPA2, WPA3
• Wi-Fi modes: STA, SoftAP, concurrent STA + SoftAP
• Bluetooth: Bluetooth LE 5.4, up to 2 Mbps
• BLE topologies: Peer-to-peer, broadcast, mesh
• Wi-Fi & BLE: Run concurrently
• Host interface: SPI (up to 40 MHz, full-duplex) or UART (2 Mbps)
• Supply voltage: 3.3 V
• IO voltage: 1.8 V or 3.3 V
• Deep sleep current: 90 µA
• Operating temperature: −40 °C to +85 °C
• Onboard crystal: 32.768 kHz oscillator
• Power stability: Decoupling capacitor bank for clean 3.3 V supply
• Antenna: Built-in PCB antenna, all RF components on-module
• Pin header: 11-pin male header (SPI, UART, CHIP_EN, BOOT, 3.3 V, GND)
• Form factor: Breadboard-friendly breakout board
• Pre-flashed firmware:
• Certifications: FCC, CE/RED, IC (Canada), JRFARIB, RCM, RoHS, REACH