ID: 0x00000069
SKU: 333060
Pressure & temperature sensor BMP180 breakout
Test data
Soldered Electronics HQ Osijek, Croatia
Jan 31, 2023 12:35 PM CET
The Pressure & temperature sensor BMP180 breakout has been meticulously tested and validated on Jan 31, 2023 at 12:35 PM CET. Comprehensive examination was executed by David, a member of the manufacturing department, within the premises of Soldered Electronics HQ in Osijek, Croatia.
During the time of assessment, the ambient temperature was recorded at 27.52°C, and the relative humidity was at 56%. All evaluated parameters and inspected aspects have been verified to be functioning within the specified standards.
This particular unit has been designated the ID 0x00000069 and can be authenticated using the Soldered Verify system.
27.52 °C Ambient temperature during the test
56 % Ambient humidity at the time of the test
Measured values at the test
| Parameter | Measured test value | Status |
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